March 15, 2018 – In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters.
This collaboration, which includes Asetek’s ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel® Compute Modules supporting high-performance Intel® Xeon® Scalable processors.
“Asetek liquid cooling solutions are designed to support high-powered CPUs in an energy-efficient and cost-effective manner,” said Andre Eriksen, Asetek CEO and Founder. We are excited about the work we’ve done with Intel to enable their customers and partners to realize the benefits that hot water liquid cooling can provide in datacenter environments.”
“Our customers are looking to use high-performance Intel processors in very dense configurations,” said Al Diaz, VP and general manager, Product Collaboration and Systems Division, Intel Data Center Group. “The work we’ve done with Asetek will enable them to support highly demanding datacenter workloads in a liquid cooled environment.”
Further announcements by Asetek related to this collaboration will be forthcoming in the next few months.
Asetek is the global leader in liquid cooling solutions for data centers, servers and PCs. Founded in 2000, Asetek is headquartered in Denmark and has operations in California, Texas, China and Taiwan. Asetek is listed on the Oslo Stock Exchange (ASETEK). For more information, visit www.asetek.com
For further information, please contact:
Asetek CEO and Founder André S. Eriksen