Aalborg, Denmark, 21 April, 2020 – Asetek today announced the largest order to date from a current HPC OEM partner for a new, high-density cluster, located in North America, for an undisclosed and existing end customer. The installation will be implemented using Asetek’s InRackCDU™ liquid cooling solution and includes up to 24 liquid cooled racks populated by up to 1,500 compute nodes using Asetek’s Direct-to-Chip™ (D2C) heat capture technology.
The order value will be between USD 600,000 - 800,000 based on final configuration, with delivery expected to be completed in Q2 2020. Annual group revenue guidance remains unchanged.
“We are pleased to see the continued success of one of our key data center OEM partners, as it expands its liquid cooling footprint with another HPC installation. The selection of Asetek by this global OEM partner is affirmation of how Asetek’s flexible and reliable solutions enable the extreme performance required in high performance computing, by efficiently cooling high density, high wattage CPUs. We look forward to additional success with this OEM partner” said André Sloth Eriksen, CEO and founder of Asetek.
Asetek, the creator of the all-in-one liquid cooler, is the global leader for liquid cooling solutions for high performance gaming and enthusiast PCs, and environmentally aware data centers. Founded in 2000, Asetek is headquartered in Denmark and has operations in China, Taiwan and the United States. Asetek is listed on the Oslo Stock Exchange (ASETEK.OL).
For further information, please contact:
CEO and Founder André S. Eriksen
+45 2125 7076, email: email@example.com